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IC Packaging and SiP Community

 
Need some stability in your Package Power?
 By Brad Griffin on October 21, 2008
It is not too late to sign up for the Package Power Integrity webinar that will be presented on 10/23 11:00 PDT. Click here to register. This webinar will give you a heads-up on new (SPB 16.2) features in the package / SiP SI tools that can be used to... Read more »
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CDNLive! - 10 Gbit package design paper available to conference attendees
 By Brad Griffin on October 01, 2008
For those of you that attended CDNLive! but may have missed the presentation on multi-gigabit package design by Kevin Roselle of Bayside Design, you can review the slide presentation by using your conference login and then downloading from here . Bayside... Read more »
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TSV, mainstream or niche?
 By Keith Felton on September 24, 2008
I'm sure many of you will have read the article in Advanced Packaging click_here where the luminaries at Georgia-Tech talk about how TSV can take us to the next level of functional integration and miniaturization. I have heard several companies (foundries... Read more »
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